In the field of semiconductor wafer cutting, an error of 0.001mm can even render a chip unusable. The seemingly insignificant granite base, once its quality fails to meet the standards, is quietly pushing your production to the brink of high risk and high cost! This article takes you directly to the hidden dangers of substandard bases, safeguarding cutting accuracy and production efficiency.
The "invisible bomb" of substandard granite bases
1. Runaway thermal deformation: The fatal killer of accuracy
Low-quality granite has an excessive coefficient of thermal expansion. Under the high-temperature environment of wafer cutting (up to 150℃ in some areas), it may undergo a deformation of 0.05mm/m! Due to the thermal deformation of the base in a certain wafer fabrication plant, the size deviation of the cut wafers exceeded ±5μm, and the single-batch scrap rate soared to 18%.
2. Insufficient structural strength: The service life of the equipment is "halved"
Unqualified bases with a density lower than 2600kg/m³ have a 50% reduction in wear resistance and falsely marked load-bearing capacity. Under frequent cutting vibrations, the surface of the base is prone to wear and micro-cracks appear inside. As a result, a certain cutting equipment was scrapped two years ahead of schedule, and the replacement cost exceeded one million.
3. Poor chemical stability: Corrosion is fraught with danger
Granite that does not meet the standards has weak corrosion resistance. The acid and alkali components in the cutting fluid will gradually erode the base, resulting in deterioration of flatness. Data from a certain laboratory shows that by using inferior bases, the equipment calibration cycle has been shortened from six months to two months, and the maintenance cost has increased threefold.
How to identify risks? Four Key testing Points You Must Read!
✅ Density test: High quality granite density ≥2800kg/m³, below this value porosity defect may exist;
✅ Coefficient of thermal expansion test: Request a test report of < 8×10⁻⁶/℃, no "high temperature deformation king";
✅ Flatness verification: Measured with a laser interferometer, flatness should be ≤±0.5μm/m, otherwise the cutting focus is prone to shift;
✅ Authoritative certification verification: Confirm ISO 9001, CNAS and other certifications, reject "three-no" base.
Guarding precision starts from the base!
Every cut on a wafer is crucial to the success or failure of the chip. Don't let substandard granite bases become a "stumbling block" to precision! Click to get the "Wafer Cutting Base Quality Assessment Manual", immediately identify equipment hazards, and unlock high-precision production solutions!
Post time: Jun-13-2025