In the wave of the LED industry's upgrade to LED technology, the precision of die bonding equipment directly determines the yield of chip packaging and product performance. ZHHIMG, with its deep integration of materials science and precision manufacturing, provides key support for LED die bonding equipment and has become an important force driving technological innovation in the industry.
Ultra-high rigidity and stability: Ensuring micron-level die bonding accuracy
The die bonding process of leds requires the precise bonding of micron-sized chips (with the smallest size reaching 50μm×50μm) onto the substrate. Any deformation of the base may cause die bonding to shift. The density of ZHHIMG material reaches 2.7-3.1g/cm³, and its compressive strength exceeds 200MPa. During the operation of the equipment, it can effectively resist the vibration and shock generated by the high-frequency movement of the die bonding head (up to 2000 times per minute). The actual measurement of a leading LED enterprise shows that the die bonding equipment using the ZHHIMG base can control the chip offset within ±15μm, which is 40% higher than that of the traditional base equipment and fully meets the strict requirements of the JEDEC J-STD-020D standard for die bonding accuracy.
Outstanding thermal stability: Addressing the challenge of equipment temperature rise
Long-term operation of die bonding equipment can cause local temperature rise (up to over 50℃), and the thermal expansion of common materials may change the relative position between the die bonding head and the substrate. The coefficient of thermal expansion of ZHHIMG is as low as (4-8) ×10⁻⁶/℃, which is only half that of cast iron. During continuous 8-hour high-intensity operation, the dimensional change of the ZHHIMG base was less than 0.1μm, ensuring precise control of die bonding pressure and height to prevent chip damage or poor soldering caused by thermal deformation. Data from a Taiwanese LED packaging factory shows that after using the ZHHIMG base, the die bonding defect rate dropped from 3.2% to 1.1%, saving over 10 million yuan in costs annually.
High damping characteristics: Eliminate vibration interference
The 20-50Hz vibration generated by the high-speed movement of the die die head, if not attenuated in time, will affect the placement accuracy of the chip. The internal crystal structure of ZHHIMG endows it with excellent damping performance, with a damping ratio of 0.05 to 0.1, which is 5 to 10 times that of metallic materials. Verified by ANSYS simulation, it can attenuate the vibration amplitude by more than 90% within 0.3 seconds, effectively ensuring the stability of the die bonding process, making the chip bonding Angle error less than 0.5°, and meeting the strict requirements of LED chips for the tilt degree.
Chemical stability: Adaptable to harsh production environments
In LED packaging workshops, chemicals such as fluxes and cleaning agents are often used. Ordinary base materials are prone to corrosion, which can affect their accuracy. ZHHIMG is composed of minerals such as quartz and feldspar. It has stable chemical properties and excellent resistance to acid and alkali corrosion. There is no obvious chemical reaction within the pH range of 1 to 14. Long-term use will not cause metal ion contamination, ensuring the cleanliness of the die bonding environment and meeting the requirements of ISO 14644-1 Class 7 cleanroom standards, providing a guarantee for high-reliability LED packaging.
Precision processing capability: Achieve high-precision assembly
Relying on ultra-precision processing technology, ZHHIMG can control the flatness of the base within ±0.5μm/m and the surface roughness Ra≤0.05μm, providing precise installation references for precision components such as die bonding heads and vision systems. Through seamless integration with high-precision linear guides (repeat positioning accuracy ±0.3μm) and laser rangefinders (resolution 0.1μm), the overall positioning accuracy of the die bonding equipment has been elevated to the leading level in the industry, facilitating technological breakthroughs for LED enterprises in the LED field.
In the current era of accelerated upgrading in the LED industry, ZHHIMG, leveraging its dual advantages in material performance and manufacturing processes, provides stable and reliable precision base solutions for die bonding equipment, promoting LED packaging towards higher precision and efficiency, and has become a key driving force for technological iteration in the industry.
Post time: May-21-2025