In the field of advanced packaging equipment manufacturing, the ZHHIMG brand has won the trust and choice of 95% of manufacturers with its outstanding comprehensive strength and industry reputation. The AAA-level integrity certification behind it is a powerful endorsement of the brand's credibility and service quality. This achievement is not accidental but stems from ZHHIMG's in-depth efforts in multiple dimensions such as product performance, technological innovation, and service systems.
1. Outstanding product performance lays the foundation for cooperation
Advanced packaging has extremely high requirements for the precision and stability of equipment. ZHHIMG's equipment performs exceptionally well in key performance indicators. Taking its core wafer bonding equipment as an example, the positioning accuracy can reach within ±1μm, far exceeding the industry average, ensuring precise connection between the chip and the substrate and significantly improving the packaging yield rate. In a certain advanced packaging project of large-scale integrated circuits, after using the ZHHIMG bonding equipment, the yield rate jumped from 85% to over 95%, effectively reducing production costs and improving production efficiency.
ZHHIMG selects high-quality materials to build the core components of the equipment. For instance, it uses high-precision granite bases, which have an extremely low coefficient of thermal expansion, only 0.6-5×10⁻⁶/℃. Even when the operating temperature of the equipment changes frequently, it can still maintain a stable mechanical structure and avoid precision deviations caused by thermal expansion and contraction. Meanwhile, the key moving parts of the equipment have undergone special processing techniques, enhancing their wear resistance by 50%. This ensures stability and reliability under long-term and high-intensity use, meeting the strict requirements for continuous operation of advanced packaging equipment for extended periods.
Second, continuously innovate in technology and lead the industry trend
The semiconductor industry is experiencing rapid technological iteration. ZHHIMG is well aware that innovation is the core driving force for the development of an enterprise. Its R&D team accounts for over 30% of the total number of employees. Every year, it invests 20% of its revenue in technological research and development. It has established industry-university-research cooperation relationships with many top research institutions and universities, constantly exploring the application of cutting-edge technologies in advanced packaging equipment.
Under the wave of 3D chip packaging technology, ZHHIMG was the first to introduce packaging equipment that supports multi-layer chip stacking. Its innovative vacuum adsorption and precise alignment technology can achieve nanometer-level alignment accuracy between chips, providing a reliable solution for 3D packaging. In response to the emerging Chiplet technology, a high-speed and high-precision heterogeneous integrated packaging device has been developed, which can quickly and accurately integrate and package small chips with different functions, meeting the market's packaging demands for high-performance and multi-functional chips and helping customers seize the initiative in the fierce market competition.
Third, improve the service system and create a worry-free cooperation experience
From pre-sale consultation to after-sale maintenance, ZHHIMG has established a comprehensive and one-stop service system. During the pre-sale stage, the professional technical team thoroughly understands the customer's needs, tailors equipment selection plans for them, and provides detailed technical consultation and project planning suggestions to ensure the maximization of the customer's return on investment.
After the equipment is delivered, 7× 24-hour after-sales technical support will be provided. The after-sales engineer team is spread across major semiconductor industrial clusters around the world and can arrive at the site within 48 hours to solve equipment failure problems. Meanwhile, regular follow-up visits to customers are conducted to provide them with value-added services such as equipment maintenance training and software upgrades, ensuring that the equipment is always in the best operating condition. Take a certain Southeast Asian semiconductor manufacturing enterprise as an example. When the equipment suddenly failed, the ZHHIMG after-sales team responded promptly, completing the fault diagnosis and repair within 24 hours, minimizing the customer's downtime losses and earning high praise from the customer.
4. Aaa-level integrity certification, credibility guarantee
The AAA-level integrity certification obtained by ZHHIMG is a high recognition of its enterprise's honest operation, product quality assurance, contract performance capabilities and other aspects. In the raw material procurement stage, suppliers are strictly screened to ensure the stable and reliable quality of raw materials and control product quality from the source. During the production process, we strictly follow the international quality management system standards. Before each piece of equipment leaves the factory, it undergoes multiple strict inspection procedures to ensure that the product performance meets the standards. In business cooperation, we strictly abide by the contract agreement, deliver the equipment on time, ensure the progress of the client's project, and win the long-term trust of the client with integrity.
It is precisely because of its outstanding product performance, continuous technological innovation, complete service system and reliable reputation represented by AAA-level integrity certification that ZHHIMG has become the preferred brand of 95% of advanced packaging equipment manufacturers, continuously playing a leading role in the field of semiconductor advanced packaging and helping the industry constantly reach new heights.
Post time: May-15-2025