Semiconductor wafer testing equipment including probe stations and AOI optical platforms requires seamless coordination between ceramic measuring components and granite bases. Tiny uneven assembly gaps will trigger optical offset, positioning deviation and electrostatic accumulation during high-speed reciprocating motion, severely affecting wafer yield. Most suppliers only deliver separate ceramic or granite workpieces without unified assembly tolerance matching, leaving equipment manufacturers to spend extra time adjusting gaps on-site. As a comprehensive ultra-precision manufacturer covering precision granite and precision ceramic production, ZHHIMG controls assembly gaps through synchronized machining and paired calibration, delivering integrated matched assemblies ready for direct installation in cleanrooms.
ZHHIMG independently produces two core matched materials: high-density black granite (3100kg/m³) and precision ceramic parts. Granite benches feature stable thermal expansion, ultra-low moisture absorption and excellent vibration damping as the fixed reference foundation. Precision ceramic components own high hardness, zero ion precipitation and outstanding anti-static performance ideal for moving measuring structures. Our technical team unifies thermal expansion matching standards for both materials in advance to avoid gap deformation caused by cleanroom temperature fluctuations.
All granite and ceramic parts are processed in the 10,000㎡ constant temperature & humidity vibration-isolated workshop. The 1000mm thick ultra-hard concrete floor and surrounding 2m deep anti-vibration trenches eliminate external vibration interference during machining and measurement. Over 30-year senior grinding masters conduct nano-finishing on granite surfaces (Ra ≤0.05μm), while ceramic parts adopt metal-free precision CNC machining to avoid foreign ion contamination. Before assembly, all workpieces pass dual inspection with Mitutoyo roughness testers, Mahr 0.5μm dial gauges and Renishaw laser interferometers, complying with DIN, ASME, JIS and GB global metrology standards. 
We implement whole-process gap closed-loop control. Dedicated assembly workshops simulating semiconductor cleanroom environments are set up for combined fitting. Technicians conduct multi-point gap measurement during assembly, adjusting matching surfaces to lock assembly clearance within standardized micron ranges. Custom insulating conductive contact structures are reserved on granite benches to realize uniform static dissipation, preventing static breakdown of wafers while maintaining stable matching gaps. After assembly, the whole assembly undergoes repeated high-low temperature cycle simulation testing to verify no gap expansion or shrinkage under temperature changes.
Every set of matched ceramic-granite assemblies is attached with complete traceability files, recording dimensional tolerance, actual assembly gap and test data, traceable to national metrology calibration standards. As the only enterprise in the industry with ISO triple system and CE certifications, ZHHIMG refuses rough assembly without gap detection, adhering to the customer commitment “No cheating, No concealment, No misleading”.
This integrated gap-controlled matching solution has been widely supplied to global semiconductor clients such as Singapore STI, Akribis, Samsung and Apple. Field application data shows that the precise matched assemblies greatly reduce on-site adjustment time for equipment manufacturers and effectively cut wafer defect rates caused by assembly gap failure. The company maintains long-term technical cooperation with global metrology institutes to continuously optimize paired machining tolerance standards for ceramics and granite.
Upholding the quality policy “The precision business can’t be too demanding”, ZHHIMG solves the assembly gap pain point of semiconductor equipment through synchronous production and unified gap calibration of ceramic and granite parts. We keep fulfilling the mission of promoting the development of the ultra-precision industry, providing stable, ready-to-install composite precision assemblies for global chip manufacturing enterprises.
Post time: Jul-20-2026